1.It has high strength and fast bonding effect, and is suitable for directly attaching various components, LEDs and heat sinks.

2.Good thermal conductivity, strong adhesion, vacuum packaging is not easy to oxidize and dry, good viscosity, short drying time.

3.It has good conductivity, wide operating temperature range (-60~200°C), and short-term resistance to 300°C.

4.It has short surface curing time, long storage period, non-toxic, solvent-free, and can be safely applied to elastic bonding, heat dissipation, insulation and packaging of electronics, instruments, LEDs, heat sinks, etc.

5.Instructions:

2) The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa.

4) Please use solvent to clean the surface of the bonded object before use (such as alcohol), avoid cleaning with detergent, and apply it after the surface is clean.

6.The package is sealing and the product is covered with a vacuum bag to insulate the air and increase the storage time.

Specifications:

Thermal properties, strong glue adhesion.

Specifications: 5g (single)

Melting amount: 0 (200°C/24 Hours)

Evaporation: 0.001% (200°C/24 Hours)

Thermal Conductivity: >0.671W/m-K

Impedance: <0.06

Ging Time: 3min (25°C)

Track Strength: 25Kg

Strength of Connected Buildings: 1.5map

Margin Coefficient: >5.1

Scatter Coefficient: <0.005

Package Included:

1 x Heatsink Plaster